Scott Bischke worked for ~ten years as the lead process environmental engineer for a wafer fab and plating shop for a major division of Hewlett-Packard. During that time he completed projects in all media. His work had a simple goal: to decrease HP's impact on the environment. Efforts ranged from project conception to design to budget justification to ordering, installation, startup, and hand off to process engineers. A list of example projects follows:

• Air Quality--minimizing output of global warming gases, volatile organic compounds, and acid gases.
• Water Quality--recovery of gold and nickel from Au and Ni plating baths.
• Toxic Use and Hazardous Waste Reduction--creation of a large volume recycle prpgram for a heavily used solvent; elimination of ozone depleting compounds.
• Pollution Prevention--instituted, for example, programs to reduce photoresist use, select non-toxic cleaning methods. Shared best practices with outsource vendors to do same.
• Product Stewardship Packaging Reductions--part of a two-person engineering team that discovered new pen body material that allowed for substantial reduction in packaging.
• Solid Waste Manufacturing Scrap Recycling--initiated an off-site recycling program for scrap inkjet pens, plus participated or lead programs to recover material from numerous manufacturing waste streams.
• Environmental Impact Statements, International Experience--principle technical contact for an EIS describing the move of inkjet manufacturing operations to Ireland. Principle technical contact and author of an EIS for moving inkjet manufacturing operations to Puerto Rico. Lead organizer and host of an HP International Environmental Conference.